System Overview:

• Offered in 2-Stack, 3-stack or 4-stack configurations

• May be configured for atmospheric, LPCVD or PECVD processes

• Heating elements with >6” dia. or >8” dia. wafer processing capability

• 18” (46cm) thermal flatzone, temperature stability full length of flatzone = + 1.0⁰C

• Inline load station with cantilever, soft-landing or pusher/puller loading systems

• Soft-Start Mass Flow Controlled gas systems

• Per tube digital process and temperature controllers

Contact Gilbert Technologies for more information about ProTemp products.