TEGAL DRIE SERIES PRODUCTS

Tegal DRIE systems are high-density plasma etch tools featuring inductively coupled plasma etch reactors and magnetic plasma confinement. The tools can run Tegal’s patented SHARP – Super High Aspect Ratio Process, achieving etched feature aspect ratios of >100:1 in production environments. Together with their high reliability, broad process windows, and superior etch rates, Tegal DRIE systems are critical enablers for etching silicon (SE) and dielectric (DE) films found in the MEMS/MOEMS, bio-tech, high-voltage, and packaging markets. Tegal DRIE tools are presently employed in numerous research and development laboratories throughout the world, as well as in high volume manufacturing and specialized foundry processing.

Tegal ProNova - Third generation of ICP

• This source was developed to reach the demand for the MEMS and 3D market, from 100 to 200 mm wafer size

• Yield is the key improvement by improving the uniformity across the wafer and by reducing the ion induced tilt at the wafer edge

• Higher source power → Higher etch rate

• The ProNova source allows higher productivity and superior performance

Tegal ProNova Source Features
ProNova coupled with latest process improvements provides:

Superior High Aspect Ratio Etch Excellent Depth Uniformity Reduce Tilt at Wafer Edge High Selectivity To Photoresist And Silicon Dioxide Yield Improvement Higher Etch Rate High Reliability More Cost-Effective Operation High-Quality Hardware and Components Comprehensive Service & Support Backward Compatibility with Earlier Source Generations Existing processes in production are easily upgradable to the new ProNova source

Contact Gilbert Technologies for more information about Tegal products.